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Meet us at the Productronica show in Munich to discuss your  system - or tool needs. Contact us any time for reserving a time slot. (Productronica, Quasys A3 116, November 12-15, 2013)


Easily remove a fully sawn wafer from a film frame, and transfer dies to a tray.
Ideal for labs or small volumes manufacturing


The inventor of the De-lidder.
Remove lids from hermetic packages for rework, quality control, failure analysis


Die Attach and Flipchip Bonding with Maximum Flexibility and Accuracy.


From pick-up tips to dispensing nozzles, from shear & pull test to ejector needles, we have the right tool for you
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